ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration
by Stephen Nuhu
A technical guide to advanced electronics packaging, covering thermal management strategies and microassembly integration for engineers and technologists.
About This Book
This book addresses advanced packaging technology for electronics, focusing on thermal dissipation strategies and microassembly integration.
It provides insights into modern approaches for managing heat and assembling microelectronic components.
Readers will find practical information relevant to engineering and technology applications in electronics packaging.
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