ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration
by Stephen Nuhu
Advanced Packaging Technology for Electronics explores thermal dissipation strategies and microassembly integration within electronic packaging. Stephen Nuhu presents a focused resource for readers seeking an introduction to the technologies and engineering considerations involved in advanced packaging for electronic systems.
About This Book
Advanced Packaging Technology for Electronics examines key concepts in the design and integration of electronic packaging.
The book focuses on thermal dissipation strategies, an important consideration in managing heat within electronic systems.
It also addresses microassembly integration, highlighting the relationship between small-scale assembly methods and packaging technology.
Written for readers interested in advanced electronics, engineering, and packaging, this volume provides a focused introduction to the subject.
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