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ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

by Ray Philip

Engineering Power Electronics Thermal Management

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ASIN B0GQZYJCGB Views 17 Publisher Independently published Year 2026 Format Paperback Product Group Book Pages 153 Adult No Created July 07, 2026 Updated September 16, 2026

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ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

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