ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis
by Ray Philip
Advanced Thermal Management for Power Semiconductors examines key areas in semiconductor thermal management, including heat sink design, packaging integration, and reliability analysis. It offers a focused resource for readers seeking an introduction to the thermal and reliability considerations associated with power semiconductor applications.
About This Book
Advanced Thermal Management for Power Semiconductors addresses the management of heat in power semiconductor applications.
The book focuses on heat sink design and its role in thermal management.
It also covers packaging integration, connecting thermal considerations with semiconductor packaging.
Reliability analysis is included as a central area of consideration.
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