Semiconductor Processing 6: Patterning, Packaging, Assembly (Semiconductor Processing Concepts)
Semiconductor Processing 6 explores patterning, packaging, and assembly as key areas of semiconductor manufacturing. Written by Peter A. Rockwell, this volume offers a focused introduction to concepts underlying these essential processing stages for students, professionals, and readers building their knowledge of semiconductor technology.
About This Book
Semiconductor Processing 6 focuses on patterning, packaging, and assembly within semiconductor manufacturing.
The book presents concepts related to how semiconductor devices are structured, packaged, and assembled.
It is intended for readers seeking an overview of important semiconductor processing topics.
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