エレクトロニクス実装技術シリーズ シグナル・インテグリティ／EMC (Japanese Edition)
by エレクトロニクス実装学会
Part of the Electronics Packaging Technology Series, this Japanese edition delves into signal integrity and electromagnetic compatibility (EMC) for electronics implementation. It equips readers with vital knowledge to tackle issues in signal transmission and interference management, ideal for professionals in electronics engineering.
About This Book
The Electronics Packaging Technology Series offers in-depth resources on advanced topics in electronics design and implementation. This volume focuses on signal integrity and EMC, addressing key challenges in modern electronic systems.
Signal integrity ensures reliable signal transmission, while EMC deals with managing electromagnetic interference. The content is tailored for engineers and researchers working on high-performance circuits.
Published by the Electronics Packaging Society, it serves as a comprehensive guide grounded in practical applications and technical standards.
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