Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)
Advances in Chemical Mechanical Planarization (CMP) provides focused technical coverage of CMP in the context of electronic and optical materials. Part of the Woodhead Publishing Series, this volume is suited to readers exploring materials processing, engineering applications, and developments in advanced technology.
About This Book
Advances in Chemical Mechanical Planarization (CMP) presents a focused treatment of chemical mechanical planarization within the broader field of electronic and optical materials.
The book is intended for readers seeking technical information about CMP and its role in materials-related research, processing, and development.
As part of the Woodhead Publishing Series in Electronic and Optical Materials, it offers subject-focused coverage for students, researchers, engineers, and other professionals working with advanced materials and manufacturing technologies.
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