Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices
Nanoparticle Engineering for Chemical-Mechanical Planarization examines nanoparticle-based approaches to planarization and their connection to next-generation nanodevice fabrication. Written for readers interested in nanotechnology, materials science, and semiconductor processing, it offers a focused technical perspective on an important area of advanced engineering.
About This Book
Nanoparticle Engineering for Chemical-Mechanical Planarization focuses on the relationship between nanoparticle engineering and chemical-mechanical planarization.
The book addresses fabrication considerations connected with next-generation nanodevices.
It is suited to readers seeking a technical introduction to nanotechnology, materials processing, and semiconductor-related manufacturing.
Written by Ungyu Paik and Jea-Gun Park, this work presents a specialized perspective on advanced planarization and device fabrication.
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