Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Modeling and Simulation for Microelectronic Packaging Assembly explores technical approaches to microelectronic packaging through three connected areas: manufacturing, reliability, and testing. Written by Yong Liu and Shen Liu, this resource offers an engineering-focused treatment for readers interested in the analysis and development of packaging assembly processes.
About This Book
Modeling and Simulation for Microelectronic Packaging Assembly examines the use of modeling and simulation in microelectronic packaging.
The book focuses on manufacturing processes, reliability considerations, and testing.
It is suited to readers seeking a technical perspective on how these areas relate within microelectronic packaging assembly.
Authors Yong Liu and Shen Liu present the subject for an engineering and applied science audience.
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