Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
A focused technical guide to copper interconnects, glass, and AI-assisted simulation for chiplets and heterogeneous integration. John Lau and Kuo-Ning Chiang bring these closely related technologies together for readers seeking an overview of materials, design considerations, and simulation approaches in advanced semiconductor integration.
About This Book
This book focuses on copper interconnects, glass, and AI-assisted simulation for chiplets and heterogeneous integration.
It brings together topics spanning advanced interconnect materials, glass-based technologies, and simulation methods supported by artificial intelligence.
Designed for readers interested in modern chiplet development and heterogeneous integration, the book presents a technical perspective on these connected areas.
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