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Semiconductor Advanced Packaging

by John H. Lau

Engineering electronics Semiconductors

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A technical reference covering advanced semiconductor packaging technologies, processes, and applications for professionals and researchers.

ISBN-13 9789811613753 ASIN 9811613753 Views 29 Publisher Springer Year 2021 Edition 2021 ed. Format Hardcover Product Group Book Pages 520 Created July 07, 2026 Updated September 23, 2026

About This Book

This book addresses advanced semiconductor packaging technologies and their applications.

It covers key processes and developments relevant to the field.

The content is intended for professionals and researchers working with semiconductor devices.

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I will be using this book for:

Semiconductor Advanced Packaging

About This Book

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I will be using this book for: