Fan-Out Wafer-Level Packaging
by John H. Lau
Fan-Out Wafer-Level Packaging provides a focused examination of the semiconductor packaging technology named in its title. Written by John H. Lau, this engineering and electronics reference is suited to readers seeking an introduction to the subject and its place within modern manufacturing technology.
About This Book
Fan-Out Wafer-Level Packaging focuses on a semiconductor packaging technology identified in the title.
The book is authored by John H. Lau.
Its subject places it within engineering, electronics, technology, and manufacturing.
This title may be useful to readers seeking focused information about fan-out wafer-level packaging.
Reviews
No reviews yet. Be the first to review this book!