Fan-Out Wafer-Level Packaging
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Fan-Out Wafer-Level Packaging

by John H. Lau

Engineering electronics Packaging Technology
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A technical reference covering the principles, materials, and manufacturing techniques of fan-out wafer-level packaging for electronics professionals.

ISBN-13 9789811342660 ASIN 9811342660 Views 79 Publisher Springer Year 2018 Edition Reprint Format Paperback Product Group Book Pages 323 Adult No Created April 08, 2026 Updated September 19, 2026
About This Book

This book examines fan-out wafer-level packaging, a key process in advanced semiconductor assembly.

It covers the fundamental principles, materials, and manufacturing techniques used in this packaging method.

The content is intended for engineers and professionals working in electronics and semiconductor industries.

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