Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection (WSPC Series in Advanced Integration and Packaging)
Explores embedded cooling strategies for electronics using conduction, evaporation, and single- and two-phase convection methods.
About This Book
This book addresses thermal management challenges in modern electronic systems through embedded cooling techniques.
It examines conduction, evaporation, and both single-phase and two-phase convection as primary heat transfer mechanisms.
The content is part of the WSPC Series in Advanced Integration and Packaging, aimed at engineering and research audiences.
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