Process Modeling of Chemical Mechanical Planarization: An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification
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Process Modeling of Chemical Mechanical Planarization: An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification

by Jihong Choi

Chemical Engineering Process Modeling Semiconductor Simulation
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An integrated model of chemical mechanical planarization from abrasive to chip scale, covering basics, characterizations, modeling, and verification.

About This Book

This book presents an integrated modeling approach for chemical mechanical planarization processes.

It covers fundamentals, characterizations, modeling techniques, and verification methods.

The work spans multiple length scales from abrasive particles to full chip structures.

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I will be using this book for: