Chemical-Mechanical Planarization: Volume 867: Integration, Technology and Reliability (MRS Proceedings)
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Chemical-Mechanical Planarization: Volume 867: Integration, Technology and Reliability (MRS Proceedings)

by E. C. Johns, A. Kumar, J. A. Lee, Y. S. Obeng, I. Vos

Conference Proceedings Semiconductor Technology Materials Research
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Proceedings volume exploring chemical-mechanical planarization, focusing on integration, technology, and reliability for semiconductor applications.

ISBN-13 9781558998209 ASIN 1558998209 Views 92 Publisher Materials Research Society Year 2005 Edition 1 Format Hardcover Product Group Book Pages 302 Created March 19, 2026 Updated August 25, 2026
About This Book

This volume presents research and developments in chemical-mechanical planarization processes used in semiconductor manufacturing.

Topics include integration challenges, process technology, and reliability considerations for advanced device fabrication.

Contributions address materials, equipment, and methodologies relevant to planarization in microelectronics production.

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