Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Yong Liu, Shichun Qu
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications presents a focused examination of wafer-level chip-scale packaging in the context of analog and power semiconductors. Written by Yong Liu and Shichun Qu, this technical title explores a specialized area of semiconductor engineering and electronics.
About This Book
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications focuses on wafer-level chip-scale packaging within the fields of analog and power semiconductors.
The book addresses a specialized area of semiconductor engineering and electronics, as indicated by its title.
Authored by Yong Liu and Shichun Qu, it is suited to readers seeking a technical treatment of packaging applications for analog and power semiconductor devices.
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