Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Yong Liu, Shichun Qu
A technical guide to wafer-level chip-scale packaging for analog and power semiconductor applications.
About This Book
This book addresses wafer-level chip-scale packaging techniques used in analog and power semiconductor devices.
It covers fundamental principles and practical considerations for packaging solutions in electronics manufacturing.
The content focuses on design, materials, and processes relevant to semiconductor applications.
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