Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
by Yong Liu
Power Electronic Packaging presents a focused examination of packaging for power electronics, bringing together design, assembly processes, reliability, and modeling. It offers an integrated technical overview for readers interested in the engineering principles and practical considerations that shape power electronic packaging.
About This Book
Power Electronic Packaging explores the technologies and practices used to package power electronic systems.
The book addresses packaging design and assembly processes, providing a foundation for understanding how these elements fit together.
Reliability is a central topic, with attention to the factors that influence dependable package performance.
Modeling is also included, rounding out the book’s coverage of power electronic packaging and its engineering considerations.
Reviews
No reviews yet. Be the first to review this book!