Introduction to Microsystem Packaging Technology
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Introduction to Microsystem Packaging Technology

by Yufeng Jin, Zhiping Wang, Jing Chen

Engineering Microelectronics Packaging Technology
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Introduction to Microsystem Packaging Technology offers a foundational introduction to the field of microsystem packaging. Written for readers seeking an accessible starting point, it provides a focused resource for understanding the technology and its role in microsystem development.

About This Book

Introduction to Microsystem Packaging Technology provides an entry point into the study of packaging for microsystems.

The book is intended for readers who want to build foundational knowledge of this technology area.

It offers a focused resource for exploring the relationship between microsystems and their packaging requirements.

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I will be using this book for: