Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
by Beth Keser, Steffen Kr¿Hnert
A technical guide to embedded and fan-out wafer and panel level packaging technologies for high-performance compute and system-in-package applications.
About This Book
This book examines advanced packaging technologies used in electronics manufacturing.
It covers embedded and fan-out wafer and panel level methods for high-performance systems.
The content focuses on applications in compute and system-in-package designs.
Readers gain insight into current industry practices and technical approaches.
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