Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of ... December 1-6, 1991 (Amd (Series), V. 131.)
by Ga.) American Society Of Mechanical Engineers. Winter Meeting (1991 : Atlanta, American Society Of Mechanical Engineers. Applied Mechanics Division, American Society Of Mechanical Engineers. Electrical And Electronic Packaging Division
This technical volume gathers material presented at the American Society of Mechanical Engineers Winter Annual Meeting in 1991. It addresses manufacturing processes and materials challenges in microelectronic packaging, with contributions associated with ASME’s applied mechanics and electrical and electronic packaging divisions.
About This Book
Manufacturing Process and Materials Challenges in Microelectronic Packaging presents material from the 1991 Winter Annual Meeting of the American Society of Mechanical Engineers.
The volume focuses on manufacturing processes and materials challenges associated with microelectronic packaging.
It was presented in Atlanta, Georgia, from December 1–6, 1991, and is identified as volume 131 in the AMD series.
Contributors include the ASME Applied Mechanics Division and Electrical and Electronic Packaging Division.
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