Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of ... December 1-6, 1991 (Amd (Series), V. 131.)
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Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of ... December 1-6, 1991 (Amd (Series), V. 131.)

by Ga.) American Society Of Mechanical Engineers. Winter Meeting (1991 : Atlanta, American Society Of Mechanical Engineers. Applied Mechanics Division, American Society Of Mechanical Engineers. Electrical And Electronic Packaging Division

Conference Proceedings Microelectronics Manufacturing Engineering
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I will be using this book for: