SemiConductor Wafer Bonding: Science and Technology
by Q.-Y. Tong, U. Gösele
This specialized reference examines semiconductor wafer bonding through both scientific and technological perspectives. Authored by Q.-Y. Tong and U. Gösele, it offers focused material for readers studying semiconductor engineering and seeking a deeper understanding of this important technical field.
About This Book
SemiConductor Wafer Bonding: Science and Technology is a specialized technical work devoted to semiconductor wafer bonding.
The book brings together scientific and technological perspectives on a key subject within semiconductor engineering.
It is authored by Q.-Y. Tong and U. Gösele and is intended for readers seeking focused reference material in this area.
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