Integrated Circuit Packaging, Assembly and Interconnections (Springer Series in Advanced Microelectronics)
This specialized volume explores integrated circuit packaging, assembly, and interconnection technologies within the broader field of advanced microelectronics. It offers engineers, researchers, and students a focused reference on the processes that connect semiconductor devices to practical electronic systems.
About This Book
Integrated Circuit Packaging, Assembly and Interconnections examines the technologies associated with integrating semiconductor devices into usable electronic systems.
The book focuses on packaging, assembly, and interconnection as central aspects of integrated circuit design and production.
It is suited to readers seeking a specialized treatment of advanced microelectronics and the engineering processes that support reliable electronic products.
Published as part of the Springer Series in Advanced Microelectronics, this volume provides a focused reference for technical study and professional use.
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