Tribology In Chemical-Mechanical Planarization
Explores tribology fundamentals in chemical-mechanical planarization, addressing friction, wear, and lubrication relevant to semiconductor manufacturing and surface finishing applications.
About This Book
This book examines tribological aspects of chemical-mechanical planarization, focusing on friction, wear, and lubrication in semiconductor manufacturing.
Authors Hong Liang and David Craven present foundational concepts and practical considerations for CMP processes.
The text serves as a resource for engineers and researchers working in materials processing and surface finishing technologies.
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