Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials)
Advances in Chemical Mechanical Planarization (CMP) offers a focused examination of developments in a specialized process associated with electronic and optical materials. As part of the Woodhead Publishing Series, this technical reference is intended for readers studying or researching CMP and related materials applications.
About This Book
Advances in Chemical Mechanical Planarization (CMP) presents focused material on a specialized technology used in electronic and optical materials.
The book addresses developments in CMP, a process concerned with achieving controlled planar surfaces in materials and device-related applications.
It is suited to readers seeking technical background and current perspectives on chemical mechanical planarization.
Published within the Woodhead Publishing Series in Electronic and Optical Materials, this volume provides a subject-specific reference for study and research.
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