Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
by John H. Lau
Technical reference on low-cost flip chip technologies for direct chip attach, wafer-level chip-scale packaging, and plastic ball grid array assemblies in electronics manufacturing.
About This Book
This book examines low-cost flip chip technologies used in modern electronics assembly.
It covers direct chip attach methods, wafer-level chip-scale packaging, and plastic ball grid array solutions.
Readers will find practical information on process considerations and cost-reduction strategies for these packaging approaches.
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