Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
This technical book examines solder joint reliability in BGA, CSP, flip-chip, and fine-pitch SMT assemblies. Written by John H. Lau and Yi-Hsin Pao, it offers a focused resource for readers interested in electronic packaging, surface-mount assembly, and the performance of solder connections.
About This Book
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies focuses on the reliability of solder joints in several advanced electronic assembly formats.
The book addresses ball grid array (BGA), chip-scale package (CSP), flip-chip, and fine-pitch surface-mount technology (SMT) assemblies.
Written by John H. Lau and Yi-Hsin Pao, it is intended for readers seeking a focused technical treatment of solder joint reliability.
Its subject matter connects electronic packaging, assembly technology, and materials performance.
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